DefenseTech BlackStar 7010

Elevate wafer dicing processes with advanced laser technology.  

Facilitating Operational Excellence in the Military

We deliver comprehensive design, manufacturing, and technology services worldwide to aerospace, defense, infrastructure, energy, industrial, nuclear, and other sectors.

DefenseTech BlackStar 7010
DTWD-7010

The BlackStar is a wafer dicing system powered by the patented Fantom Width Laser Dicing Technology ™ (FWLDT™) developed to produce a clean, near-zero kerf without micro-cracks, fragmentation, or chipping. It is engineered using short-pulse laser technology for precise and waste-less die singulation. It involves minimal heat to separate brittle, high-value semiconductor materials like silicon, greatly improving die yield and saving time and labor.

Wafer Dicing with Laser Technology

The DefenseTech BlackStar 7010 is powered by patented laser wafer dicing technology that helps maximize die yield per wafer.

Safe

Easy To Use

Eco-Friendly

Cost-Effective

Key Features

  • FWLDT™ Patented Technology
  • Minimal Heat-Affected Zone (HAZ)
  • Capable of Dicing Wafers Up to 12 in
  • Generates No Chips or Debris
  • Compatible With Various Wafer Materials
  • High Scribing Speed – Up to 200 mm/s
  • CDRH Class I Laser Safety Enclosure
  • Touchscreen Interface

Safety Features

The DTWD-7010 BlackStar is a Class I laser instrument that incorporates additional safety measures for easy and safe operation across all work environments.

Safe-Viewing Windows | Safety Labels | Interlocking Device | Emission Indication | Emergency Stop Button

Safety Features

The DefenseTech Handheld Laser cleaning machines are Class IV laser instruments that incorporate additional safety measures for easy and safe operation across all industries and work environments.

 Emergency Stop  |  Key Switch  | Remote Interlock | Reset & Emission Indication

  • 2D UDI/UID Barcoding
  • QR Code Marking
  • Sequential Serial Numbers
  • Alphanumeric Marking
  • Lot and Dates Codes
  • Logos and Schematics
  • Medical/Automotive Coding
  • Anodized Ablation
  • IC Chip Package Marking
  • Paint Ablation & Removal
  • Part Numbering
  • Surface Annealing/Etching
  • 3D Engraving/Deep Engraving
  • Complex Graphics
  • Aluminum
  • Rubber & Silicon
  • Synthesized Plastics
  • Nylon/Valox
  • Titanium and Nickel
  • Multi-Coated Materials
  • Polycarbonate
  • Coated Plastic
  • Galvanized Metals
  • Polypropylene
  • Carbide/PVC
  • Painted Metal Alloys
  • Glass
  • Chrome & Cast Iron
  • Ceramics
  • Power Output: 20 Watt
  • Laser Safety Class: Class IV
  • Wavelength: 1064 nm
  • Operating Mode: Q-switch
  • Cable Length: 3m
  • Marking Area: 2” x 2”
  • User Interface: USB Port Supporting Windows 11/FiberScan C3 LT

Why Choose

Fonon Technologies

We stand out as industry leaders and innovators, offering laser systems designed for government organizations, military branches, and defense applications. Our selection of advanced technologies provides cost-effective, safe, and reliable solutions to streamline MRO processes. With increased mobility, smart safety features, and compliance with stringent industry regulations, the next-generation DefenseTech series empowers users to maintain critical equipment with minimal downtime and maximum efficiency.

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Intelligent Laser Solutions

Intuitively designed defense technology that is operator-friendly and easy to integrate.

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Military Focused Systems

We deliver laser solutions tailored for defense and military applications, ensuring world-class performance.

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Enhanced Operations

Fonon Technologies provides solutions that facilitate operational excellence and modernize processes.

Get in Touch for More DefenseTech Insights

Our DefenseTech Products have been Demonstrated Throughout The U.S.

If you would like to learn more, please contact us today for additional information!