DefenseTech BlackStar 7010

Elevate wafer dicing processes with advanced laser technology.  

Facilitating Operational Excellence in the Military

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DefenseTech BlackStar 7010
DTWD-7010

The BlackStar is a wafer dicing system powered by the patented Fantom Width Laser Dicing Technology ™ (FWLDT™) developed to produce a clean, near-zero kerf without micro-cracks, fragmentation, or chipping. It is engineered using short-pulse laser technology for precise and waste-less die singulation. It involves minimal heat to separate brittle, high-value semiconductor materials like silicon, greatly improving die yield and saving time and labor.

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Wafer Dicing with Laser Technology

The DefenseTech BlackStar 7010 is powered by patented laser wafer dicing technology that helps maximize die yield per wafer.

Safe

Easy To Use

Eco-Friendly

Cost-Effective

Key Features

  • FWLDT™ Patented Technology
  • Minimal Heat-Affected Zone (HAZ)
  • Capable of Dicing Wafers Up to 12 in
  • Generates No Chips or Debris
  • Compatible With Various Wafer Materials
  • High Scribing Speed – Up to 200 mm/s
  • CDRH Class I Laser Safety Enclosure
  • Touchscreen Interface

Safety Features

The DTWD-7010 BlackStar is a Class I laser instrument that incorporates additional safety measures for easy and safe operation across all work environments.

Safe-Viewing Windows | Safety Labels | Interlocking Device | Emission Indication | Emergency Stop Button

Safety Features

The DefenseTech Handheld Laser cleaning machines are Class IV laser instruments that incorporate additional safety measures for easy and safe operation across all industries and work environments.

 Emergency Stop  |  Key Switch  | Remote Interlock | Reset & Emission Indication

  • 2D UDI/UID Barcoding
  • QR Code Marking
  • Sequential Serial Numbers
  • Alphanumeric Marking
  • Lot and Dates Codes
  • Logos and Schematics
  • Medical/Automotive Coding
  • Anodized Ablation
  • IC Chip Package Marking
  • Paint Ablation & Removal
  • Part Numbering
  • Surface Annealing/Etching
  • 3D Engraving/Deep Engraving
  • Complex Graphics
  • Aluminum
  • Rubber & Silicon
  • Synthesized Plastics
  • Nylon/Valox
  • Titanium and Nickel
  • Multi-Coated Materials
  • Polycarbonate
  • Coated Plastic
  • Galvanized Metals
  • Polypropylene
  • Carbide/PVC
  • Painted Metal Alloys
  • Glass
  • Chrome & Cast Iron
  • Ceramics
  • Power Output: 20 Watt
  • Laser Safety Class: Class IV
  • Wavelength: 1064 nm
  • Operating Mode: Q-switch
  • Cable Length: 3m
  • Marking Area: 2” x 2”
  • User Interface: USB Port Supporting Windows 11/FiberScan C3 LT

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Our DefenseTech Products have been Demonstrated Throughout The U.S.

If you would like to learn more, please contact us today for additional information!

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