Products
Accurately mark IC mold compounds for tracking wafer data.
We deliver comprehensive design, manufacturing, and technology services worldwide to aerospace, defense, infrastructure, energy, industrial, nuclear, and other sectors.
The DefenseTech Chip Packaging system is specifically designed for marking molding compounds that encapsulate and protect integrated circuits is a delicate task that requires precision and speed. The DTCP-7030 laser system offers the utmost control in the permanent marking of even the smallest chip packaging, greatly optimizing this step in manufacturing. It employs an ultraviolet laser for marking IC molding compounds with minimal heat.
The DefenseTech Chip Packaging 7030 is designed in compliance with TAA and produces permanent marks without damage to the encapsulated chip.
The DTLM-7030 is a Class I laser instrument that incorporates additional safety measures for easy and safe operation across all work environments.
Laser Safe Window | Safety Labels | Interlocking Device | Emergency Stop Button | Fume Extraction System
Our DefenseTech Products have been Demonstrated Throughout The U.S.
If you would like to learn more, please contact us today for additional information!
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