DefenseTech Expeditionary Corrosion KitThe DTECK ensures rapid, safe, and effective surface maintenance in both field and depot-level environments housing our TRL 9 laser cleaning systems within an A/C-powered, mobile, and expeditionary container. Read More
DefenseTech Chip Packaging 7030The DefenseTech Chip Packaging system is specifically designed for marking the IC mold compounds that encapsulate and protect the delicate silicon die after it’s been cut. Read More
DefenseTech Wafer Marking 7020The DefenseTech Wafer Marking system is specifically designed for engraving serial numbers onto wafers with the use of an ultraviolet laser. Read More
DefenseTech BlackStar 7010The BlackStar™ is a wafer dicing system utilizing a patented Fantom Width Laser Dicing Technology™ (FWLDT™) developed to produce a clean, near-zero kerf without micro-cracks, fragmentation, or chipping Read More