The DefenseTech Chip Packaging system is specifically designed for marking the IC mold compounds that encapsulate and protect the delicate silicon die after it’s been cut.
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The DefenseTech Wafer Marking system is specifically designed for engraving serial numbers onto wafers with the use of an ultraviolet laser.
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The BlackStar™ is a wafer dicing system utilizing a patented Fantom Width Laser Dicing Technology™ (FWLDT™) developed to produce a clean, near-zero kerf without micro-cracks, fragmentation, or chipping
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