In a strategic move to enhance our product offerings and support military maintenance, repair, and overhaul (MRO), Fonon Technologies now offers an advanced wire processing system. The DefenseTech DTWP-6010 is a state-of-the-art laser wire processing solution designed to meet the rigorous demands of defense applications.
The addition of wire processing capabilities into Fonon Technologies’ product portfolio exemplifies our commitment to providing cutting-edge solutions for the Federal Government and the Department of Defense (DOD). The DefenseTech DTWP-6010 is engineered to streamline wire processing tasks, ensuring efficiency, precision, and rapid turnover in maintaining critical defense equipment.
Challenges of Traditional Wire Processing Processes
In the military, wires can be exposed to demanding stressors, like extreme cold, intense heat, continuous vibrations, exposure to chemicals, and underwater environments. While components are engineered for resilience under all conditions, their long-term reliability hinges on precise and consistent maintenance practices, whether at depot-level facilities or forward-operating bases (FOBs).
Despite these demands, many traditional wire processing methods remain outdated. Mechanical wire stripping and cutting are labor-intensive, and susceptible to human error and safety risks. These methods often rely on manual tools—such as cable stripper kits and heavy-duty pliers—that can compromise wire integrity or result in operator injury.
Wire marking, in particular, poses a major challenge. Conventional methods typically involve cleaning the insulation with alcohol, applying laminated labels by hand, and hoping they remain adhered in hostile environments. In reality, these labels often fail when exposed to heat, moisture, or abrasion—putting both equipment performance and mission readiness at risk.
The 2022 National Defense Strategy acknowledged that the nation’s current process for advancing the Joint Force, and its technologies is “too slow and too focused on acquiring systems not designed to address the most critical challenges”.
Fonon Technologies’ DTWP-6010 laser wire processing system directly addresses this issue—delivering a next-generation solution built for speed, precision, and safety. By adopting advanced laser technology, the Joint Force can modernize its wire maintenance processes with a system that improves efficiency, reduces costs, and enhances operator safety—all while supporting the DOD’s push for innovation and modernization.
Key Features of the DTWP-6010
Laser Wire Marking: Utilizing On-The-Fly (OTF) marking technique and a highly precise UV laser, the DTWP-6010 delivers permanent, high-contrast surface marks on wire insulation. This feature is essential for clear identification and traceability of wiring in complex military systems. Depending on the data being marked, our laser system can reach speeds exceeding 120 inches per second.
Laser Wire Stripping: Equipped with dual CO2 lasers, the system offers non-contact stripping of wire insulation. This method ensures zero defects or damage to the wire core, preserving the integrity and performance of the wiring.
Wire Cutting: The inclusion of mechanical blades allows for straight perpendicular cutting of wires to specified lengths, facilitating the preparation of wiring harnesses and assemblies.
Versatility: The system can process various wire types, like shielded twisted pairs, and various insulation coating types, such as polyimide, urethane, lacquer, Kapton® and formvar. This adaptability makes it suitable for a wide range of military wiring applications.
Safety and Compliance: Designed as a CDRH Class 1 laser system, the DTWP-6010 incorporates safety interlocks and a laser safe window to protect operators.
Learn More About Our Laser Wire Processing Systems here.
Advantages Over Traditional Methods
Our cutting-edge laser wire processing system leverages advanced CO₂ laser technology for precision wire stripping and high-speed, on-the-fly laser marking—offering a superior alternative to traditional ink-based and mechanical methods.
Key Advantages Over Conventional Processes:
Unmatched Precision: Laser technology ensures consistent, highly accurate stripping and marking with minimal risk of damaging the wire core and insulation (respectively) —especially critical for delicate or high-density wiring systems.
Enhanced Efficiency: Automated laser processing streamlines production workflows, enabling marking, stripping, and cutting to occur within a single integrated system—ideal for complex harness boards.
Cost Savings: Reduced rework, fewer defects, and lower material waste lead to decreased operational costs and improved productivity, ultimately saving time and man-hours.
Environmentally Responsible: Laser-based processing eliminates the need for inks, solvents, and other consumables, resulting in a cleaner, more sustainable operation.
DTWP-6010 Additional Features
Our wire processing system is computer-controlled and features a monitor and keyboard mounted on an ergonomic arm for operator comfort and efficiency. The system supports both touchscreen and mouse input. The software is capable of managing large-scale job files, including operations involving over 100,000 wires in a single task. Comprehensive wire data-post management includes robust logging capabilities for accurate tracking and metering of wire production.
Laser Wire Processing Safety Features
The DTWP-6010 Laser Wire Processing System is TAA-compliant and classified as a Class I laser product under CDRH laser safety standards. Its precision wire marking capabilities meet the SAE International AS5649 standard, ensuring compliance for aerospace vehicle electrical wires and cables.
Engineered with operator safety in mind, the system includes integrated safety interlocks, a laser-safe viewing window, an emergency stop button, and a fume extraction system to support a clean and controlled work environment. All optical and laser components are securely mounted on a rigid steel base frame to ensure stability and long-term operational reliability.
Commitment to Excellence in Defense Applications
Fonon Technologies’ DTWP-6010 wire processing system is engineered to support the evolving needs of the defense sector, reinforcing our commitment to advancing military MRO capabilities. By integrating cutting-edge laser technology for precision wire stripping and marking, we help improve the reliability, efficiency, and mission readiness of critical defense systems.