DefenseTech Chip Packaging 7030

The DefenseTech Chip Packaging system is specifically designed for marking the IC mold compounds that encapsulate and protect the delicate silicon die after it’s been cut.

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DefenseTech BlackStar 7010

The BlackStar™ is a wafer dicing system utilizing a patented Fantom Width Laser Dicing Technology™ (FWLDT™) developed to produce a clean, near-zero kerf without micro-cracks, fragmentation, or chipping

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DefenseTech Bulk-to-Shape

Bulk-to-Shape (BTS™) Transformational Technology is an innovative approach to additive manufacturing that enables highly precise 3D metal printing. It transforms bulk raw material into consistent and repeatable powder stock in the same chamber, and forms powder into the desired and usable printed metal part.

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DefenseTech MRLS Marking Laser 5010

Our easy-to-use and reliable laser marking solutions solve challenges associated with parts identification, component tracking, supply chain management while meeting military standards.

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